Brynn Final Presentation.pdf

I will discuss methods I developed for securing silicon chips designed for quantum information directly onto printed circuit boards for operation and measurement at milliKelvin temperatures. The chips are currently connected by a tedious and fragile approach known as “wirebonding”. My efforts focused on reflow soldering, a common practice used in electronics manufacturing that provides robust and reliable connections but is unproven for cryogenic applications. Through systematic research and testing, I implemented a reflow process that is designed to create strong mechanical and electrical connections between the chip and PCB, capable of enduring these harsh conditions. This study improves our understanding of how electronic assemblies perform at cryogenic temperatures, supporting advancements in fields such as quantum computing, electronics, and scientific instrumentation.